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4 Expensive PCB Mistakes

4 Expensive PCB Mistakes

Printed circuit board design is a complex process and the margin for error is high. Mistakes made in the design stage of the PCB fabrication process are costly, both financially and in development time. There are any number of things that can go wrong with PCB design,...

Understanding Multi-layer Circuits

Understanding Multi-layer Circuits

A multi-layer circuit is defined as a PCB that is fabricated with three or more conductive copper foil layers. The board is arranged in such a way so that at least two layers can be placed on the surface sides of the board for connection to the environment. All layer...

Ball Grid Arrays

Ball Grid Arrays

Ball grid array is one of the most commonly used surface mount packages. BGA employs a grid of solder balls or leads to conduct electrical signals. The BGA uses solder balls that are placed on the printed circuit board instead of pins.  Unlike pin grid assembly...

Understanding Single-layer Circuits

Understanding Single-layer Circuits

Circuit construction is generally considered one of the more interesting fields in the electronic fabrication industry and throughout the 21st century has been visited with substantial innovation. In fact, many concepts have only recently been developed to the...

The Creator of the IC.

The Creator of the IC.

   Jack Kilby is largely credited as the pioneer of the first integrated circuit alongside Robert Noyce who later invented a similar circuit several months after Kilby’s presentation in September of 1958. Kilby came from a family of engineers in...